底部填充工藝對點膠機有什么性能要求嗎?
　　What are the performance requirements of the dispensing machine for the bottom filling process?
　　底部填充工藝就是將環(huán)氧樹脂膠水點涂在倒裝晶片邊緣，通過“毛細(xì)管效應(yīng)”，膠水被吸往元件的對側(cè)完成底部充填過程，然后在加熱的情況下膠水固化。
　　The bottom filling process is to apply the epoxy resin glue point on the edge of the flip chip, through the "capillary effect", the glue is sucked to the opposite side of the component to complete the bottom filling process, and then the glue solidifies when heated.
　　底部填充工藝對點膠機有什么性能要求嗎?
　　What are the performance requirements of the dispensing machine for the bottom filling process?
　　1.底部填充要對膠水進行加熱，要保持膠水的溫度，因此我們的點膠機設(shè)備必須要具有熱管理功能。
　　1. For bottom filling, the glue shall be heated first, and the glue temperature shall be maintained. Therefore, our dispensing machine equipment must have thermal management function.

　　2.底部填充工藝需要對元器件進行加熱，這樣可以加快膠水的毛細(xì)流速，并為正常固化提供有利的保障。
　　2. The bottom filling process needs to heat the components, which can speed up the capillary velocity of glue and provide favorable guarantee for normal curing.
　　3.底部填充工藝對點膠的精度要求也很高，尤其是RF屏蔽罩已經(jīng)組裝到位時，需要要通過上面孔來進行點膠操作。
　　3. The bottom filling process also requires high dispensing accuracy, especially when the RF shield has been assembled in place, the dispensing operation needs to be carried out through the upper hole.
　　綜上所述，以上就是底部填充工藝對點膠機的性能方面的要求，我們大家在對底部填充工藝進行點膠的過程中要格外注意，希望對大家有所幫助!
　　To sum up, the above is the requirements of the bottom filling process on the performance of the dispenser. We should pay special attention to the bottom filling process in the process of dispensing, hoping to help you!